flip chip
英 [flɪp tʃɪp]
美 [flɪp tʃɪp]
叩焊晶片；反装晶片；倒装片；倒装法
双语例句
- Design of a Vacuum Adsorption Dumping Gear for Flip Chip
真空吸附式倒装芯片翻转机械手设计 - Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film
倒装芯片各向异性导电胶互连的剪切结合强度 - Effect of Solder Pad Size on Solder Joint Reliability upon Flip Chip PBGA Packages
焊盘尺寸对FC-PBGA焊点可靠性的影响 - Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate
以氮化铝陶瓷为基板的倒装式封装工艺研究 - An Overview of Non destructive Inspection in Flip Chip Packaging
倒装焊芯片封装中的非接触检测技术 - As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。 - Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段 - Wafer chip scale packaging ( WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.
晶圆级芯片尺寸封装（WCSP）消除了类似传统的芯片键合、引线键合和倒装芯片贴装过程的封装工序。 - The Research on a Low Cost Flip Chip Bumping Process by Stencil Printing
一种低成本倒装芯片用印刷凸焊点技术的研究 - With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.
本实验显示经过最佳化的传输线路设计与凸块分布，低成本高效能的覆晶封装结构目标可以达成。 - Research on Alignment Methods and Optical Systems for Automatic Flip Chip Bonders Used for the appraisal of the color in standard light source.
自动倒装贴片机对准方法研究及光路设计用于在标准光源条件下对颜色进行视觉评价。 - The Study of the Spread and Diffusion Process of Oil Spilled from Seabed Pipeline; Underfill Delamination of Flip Chip on Low-Cost Board
海底管线溢油在水体中的运移扩散过程研究低成本基板倒装焊底充胶分层裂缝扩展研究 - A crack, crevice, or split. Underfill Delamination of Flip Chip on Low-Cost Board
裂缝裂隙、缺口或裂缝低成本基板倒装焊底充胶分层裂缝扩展研究 - Affect and analysis of oxidation layer for the quality of flip chip bonding
氧化层对于倒装焊接质量的影响和分析 - Area Array Package BGA/ CSP flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术 - Cleft palate; deformed condition in which the roof of a person's mouth is split at birth Underfill Delamination of Flip Chip on Low-Cost Board
唇裂（出生时唇板裂开的畸形）.低成本基板倒装焊底充胶分层裂缝扩展研究 - Flip Chip on Board ( FCOB) has been used widely as a microelectronics packaging structural form.
板上倒装芯片（FCOB）作为一种微电子封装结构形式得到了广泛的应用。 - Application of Vision System and The Study of Contraposition Arithmetic of Flip Chip Bonding Machine
倒装焊机中视觉系统的应用及对位算法研究 - Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。 - Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging
倒装芯片技术中无铅凸点电迁移研究 - Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging
倒装芯片封装材料&各向异性导电胶的研究进展 - Research on Fabrication Technology of Bumps for Flip Chip
用于倒装芯片的晶片凸点制作工艺研究 - The methods of3D interconnection can be classified into the wire bonding, flip chip, through silicon via ( TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。 - Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。 - Thermosonic flip chip bonding is a reliable and efficient connection technique for power optoelectronic devices.
结果表明，在合适的热超声参数范围内，焊接后的功率型LED光电特性和出光一致性较好，证明了热超声倒装焊接技术是一种可靠有效的功率型光电子器件互连技术。 - This paper summarizes bonding process for COF and Au-Sn bonding flip chip COF technology using pre-applied underfill process.
概述了COF粘结技术以及应用底部填料预涂工艺的Au-Sn粘结倒芯片COF技术。 - The embedded active chip also can be realized by backside thinning and flip chip bonding.
通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。 - We constructed a mathematical model for heat transfer in the flip chip structure and provided the solving procedure.
建立了倒装焊结构的热传导数学模型，并给出了解析求解过程。 - And for underfilled assemblies, application of high frequency ultrasonic microscopy in flip chip inspection was developed.
对于有底充胶的样品，发展了高频超声检测技术在倒装焊接中的应用。 - Flip chip technology has taken a revolutionary progress of packaging.
倒装芯片技术的出现，使封装技术发生了革命性的进步。